Bonding Review
1. Properties of materials exhibiting ionic bonds (remember: no
molecules)
a) high melting and boiling points
b) solids at room temperature
c) water dissolves most ionic substances
2. Properties of Covalently bonded molecules:
a) electrically neutral
b) low melting point and boiling points
c) gases or volatile liquids at room temperatures
d) organic solvents will dissolve them
3. Properties of those compounds exhibiting polar covalent bonds:
a) increased boiling and melting points
b) higher heats of vaporization and fusion
c) greater intermolecular forces causing lower vapor
pressures
d) greater attraction for ions
e) polarity making water a good solvent
4. Properties of those materials exhibiting hydrogen bonds:
a) combination of attraction between opposite charges and
covalent character
b) causes water to have high boiling point and specific heat
c) causes ice to have hexagonal openings resulting in lower
density than water
d) produces adhesion, cohesion, surface tension, and
capillary action
e) cause coiled shape of protein molecules; as in DNA and RNA
5. Properties of metallically bonded substances:
a) good conductors of heat and electricity because of
mobility of electrons
b) high luster because valence electrons absorb and re-emit
light
c) binding action of electrons being basis for hardness of
metal
d) ductile/malleable/sectile because ions and electrons can
move into other positions without breaking up structure
e) ease with which valence electrons move within crystal
shows difference between metallic bonds and either ionic or
covalent bonds
